SiC MOTION-STAGE BEAMS
High-stiffness structures for fast precision motion.
Lightweighted silicon-carbide beams are developed for wafer stages and ultra-precision motion systems where inertia, rigidity and thermal stability must be managed together.
Motion-stage application
The verified application uses the beam to carry a wafer stage through high-speed, ultra-precision motion, making mass distribution and geometric stability key design inputs.
Lightweight structural design
Internal hollowing and application-specific rib layouts can reduce moving mass while retaining load paths, mounting zones and functional interfaces.
Material advantages
High stiffness, low thermal expansion, high density and wear resistance support repeatable geometry under acceleration and environmental temperature change.
Verified precision example
The technical specification records flatness and parallelism capability up to 1 μm for representative beam products. Final tolerances depend on size, datum scheme, machining route and inspection definition.
Information for evaluation
Please provide the 3D model and 2D drawing, travel direction, acceleration and load conditions, mounting datums, allowable mass, target geometry and operating temperature range.
PROCESS CHOICES & DOCUMENTED EXAMPLES
Less moving mass. A stable reference.
Lightweight pockets and hollow structures must preserve the load path and mounting datums.
Swipe the table sideways to compare all columns.
| Review item | Documented capability | Acceptance planning |
|---|---|---|
| Flatness / parallelism | Down to 1 μm in the source examples | Confirm span, supports and measurement temperature. |
| Lightweight design | Geometry tailored to the application | Assess stiffness and loads before removing material. |
Examples describe specific designs and test conditions, not guaranteed specifications for every part. Confirm the drawing, material and acceptance criteria before ordering.
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