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Choose the process that solves the part. / 零件卡在哪裡,就從哪裡選製程。

CORE CAPABILITIES

Choose the process that solves the part.

We integrate metal additive manufacturing, precision forming, machining, semiconductor process interfaces, packaging materials, finishing and quality validation—selecting the right route for each structure, material, operating condition and production volume.

7Integrated capability groups
3Industry solutions
Design → ProductionIntegrated delivery
01FROM BRIEF TO DELIVERY

One complete manufacturing journey.

We participate early in design and process evaluation, connecting materials, equipment and cross-process resources to reduce repeated trials and supplier handoffs.

01

Requirements & DFM

02

Material & process selection

03

Prototype & validation

04

Forming or printing

05

Thermal & post-processing

06

Inspection & delivery

02INTEGRATED CAPABILITIES

Choose the process around the part.

We evaluate geometry, material, performance, finish and volume before defining the manufacturing route.

03INDUSTRY SOLUTIONS

Process integration for demanding applications.

Manufacturing capabilities become more valuable when they are connected to application knowledge, material behavior and real operating conditions.

04REPRESENTATIVE APPLICATIONS

See capability through real parts.

Concrete applications help customers quickly judge which process and experience fit their product requirements.

01

Complex channels

Metal additive manufacturing realizes internal structures that conventional machining cannot easily produce.

02

Lightweight structures

Topology optimization and lattice design balance weight, strength and function.

03

Precision MIM parts

Near-net-shape production supports intricate, high-strength components at scale.

04

Semiconductor thermal parts

Silicon carbide addresses high-temperature, corrosion-resistant and clean-process requirements.

05

Wafer handling

Component solutions support wafer carrying, vacuum holding and precision dicing.

06

Wafer plating & carrier-tape packaging

CRS interfaces and M6 cover tape support conductive sealing, packaging stability and application-specific verification.

07

Tooling applications

Shorter tooling development expands venting, internal structures and custom design possibilities.

05EQUIPMENT & PRODUCTION

Capability supported by production resources.

Final dimensions, tolerances and capacity depend on material, geometry and project conditions. Share a drawing for a practical assessment.

01

Equipment

Metal 3D printing, injection molding, debinding and sintering, precision machining and quality inspection equipment.

02

Materials

Metal powders, engineering plastics and silicon carbide are evaluated against performance, environment, cost and volume.

03

Production

Support spans rapid prototyping, pilot runs, process validation and scalable production; actual capability is drawing- and material-dependent.

04

Validation

Controls span incoming inspection, in-process checks, dimensional and visual measurement, outgoing inspection and batch traceability.

+PROJECT ASSESSMENT

Not sure which process fits your product?

Share your drawing, material requirements, estimated volume and application conditions. Our team will help evaluate a suitable manufacturing route.

Consult a manufacturing solution ↗

PROCESS CHOICES & DOCUMENTED EXAMPLES

A difficult part deserves the right process.

Start with the geometry, then compare tooling, volume and finishing. Quantity alone does not decide the route.

Swipe the table sideways to compare all columns.

Part challengeProcess to assessWhat to check
Internal channels or frequent design changesMetal 3D printingBuild direction, powder removal, support removal and machined interfaces.
Small, intricate metal parts in repeat ordersMIM + local precision machiningTooling cost, shrinkage, datum control and annual volume.
Thin housings with demanding appearanceThin-wall / zero-draft injection evaluationResin flow, warpage, texture and demolding trials.
Lightweight covers with local reinforcementCFRP / GFRP compression moldingLayup, core, bonded interfaces and RF requirements.
Stable wafer support under heat or chemicalsDense SiC or porous ceramicContact pattern, vacuum distribution, material grade and cleaning.

Examples describe specific designs and test conditions, not guaranteed specifications for every part. Confirm the drawing, material and acceptance criteria before ordering.

START A PROJECT

Let’s manufacture what comes next.

Share your design, application or manufacturing challenge.

Talk to our team↗
Galaxy Star Co., Ltd.
03-3603666

6F., No. 423-1, Zhengguang Rd., Taoyuan Dist., Taoyuan City, Taiwan (R.O.C.) 330

Business registration no. 54817058